VisionSuper28 Vision Application Board

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VisionSuper28 Vision Application Board User's Guide Literature Number: SPRUI53 February 2016 2 SPRUI53–February 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Table of Contents Contents 1 Overview............................................................................................................................. 4 1.1 Vision Application Board ................................................................................................ 6 1.2 Features ................................................................................................................... 7 2 Hardware ............................................................................................................................ 8 2.1 Hardware Architecture................................................................................................... 8 3 Image Sensors Head Boards ................................................................................................. 9 3.1 Proprietary Image Sensor Head Board Interface .................................................................... 9 3.2 FPD-Link III FMC DS90UB914Q Daughter Board Interface ...................................................... 13 3.3 HDMI Receiver Interface .............................................................................................. 15 3.4 Auto Vision Video Muxing ............................................................................................. 16 3.5 CPLD Logic.............................................................................................................. 17 3.6 CAN Interface ........................................................................................................... 19 3.7 I2C Interface............................................................................................................. 20 3.8 GPIO Control and Monitor............................................................................................. 23 3.9 Power Supply Tree ..................................................................................................... 24 4 References ........................................................................................................................ 25 www.ti.com SPRUI53–February 2016 3 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated List of Figures List of Figures 1 Vision Application Board Block Diagram ................................................................................. 5 2 Vision Application Board ................................................................................................... 6 3 Board With Imager Head Board Stackup Views......................................................................... 7 4 Board With Components Identifications .................................................................................. 9 5 LI Image Sensor Head Board Assembly ................................................................................ 10 6 LI Dual Image Sensor Head Board Mounting .......................................................................... 11 7 OmniVision Imager Head Board Assembly ............................................................................. 11 8 OmniVision Image Head Board Assembly on Silver Box ............................................................. 12 9 Aptina Head Board Assembly ............................................................................................ 12 10 Board Presence Detection ................................................................................................ 14 11 HDMI Wiring Connection .................................................................................................. 15 12 HDMI Signal-Level Connections ......................................................................................... 16 13 CPLD Logic Implementation .............................................................................................. 18 14 I2C Interface in Vision Apps Board ...................................................................................... 21 15 HDMI E-DDC I2C Interface ............................................................................................... 22 16 Power Supply Tree Chart ................................................................................................. 24 List of Tables 1 Hardware Architecture ...................................................................................................... 8 2 List of De-Multiplexed Signals ............................................................................................ 13 3 CAM Input De-Multiplexer................................................................................................. 13 4 De-Multiplexing as Per Required Configuration ........................................................................ 14 5 Mux Output Selection Chart .............................................................................................. 17 6 List of Dip Switch Signals ................................................................................................. 17 7 Camera Data Modes....................................................................................................... 17 8 VIN and Camera Signal Mapping ........................................................................................ 19 9 I2C Devices Slave Address ............................................................................................... 20 10 HDMI E-DDC I2C Device Addresses .................................................................................... 22 11 GPIO Mapping of Device Control ........................................................................................ 23 4 SPRUI53–February 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated VisionSuper28 Vision Application Board Aptina is a trademark of Aptina Imaging Corporation. OmniVision is a trademark of OmniVision Technologies. All other trademarks are the property of their respective owners. User's Guide SPRUI53–February 2016 VisionSuper28 Vision Application Board This user's guide provides the detailed information about various video input options, user configuration details, GPIO selection, imager head board mounting details from the user's point-of-view to make more effective usage and yield the targeted benefits of the vision application board. 1 Overview The vision application board supports automotive vision video multiplexing options for different video input sources. As the board supports multiple video inputs and multiplexing options, it is a solution for advanced driver assistance systems (ADAS) development activity. This evaluation module (EVM) is based on TI VisionSuper28-series System-on-Chip (SoC) silicon solutions. The vision application, based on the VisionSuper28 EVM, consists of the following: • Application board – Supports the multiplexing option for proprietary camera modules – Supports FPD-Link III FMC DS90UB914Q daughter board for stereoscopic view and/or surround view camera interface – Supports HDMI and CAN interfaces • FPD-Link III FMC DS90UB914Q daughter board – Supports four high-resolution cameras for surround view – Supports five or six lower-resolution cameras for surround and stereoscopic view • VisionSuper28 CPU board – Supports SoC – Supports memory devices, other interfaces, and so forth • Stand-alone camera module head boards – AR0132AT6C00XPEAH-E head board from Aptina™ – OV10635 head board from OmniVision™ – Single-imager head board from Leopard imaging – LI-M024-DUAL image head board from Leopard imaging (LI) • Four surround-view image sensor head boards with serializer boards • Stereoscopic-view image sensor head boards with serializer boards • Linear guide rail to adjust the position of stereoscopic image sensor www.ti.com Overview SPRUI53–February 2016 5 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated VisionSuper28 Vision Application Board Figure 1 shows the block diagram of the vision application board. Figure 1. Vision Application Board Block Diagram Overview www.ti.com 6 SPRUI53–February 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated VisionSuper28 Vision Application Board 1.1 Vision Application Board Figure 2 shows the physical view of vision application board. The vision application board is used as an add-on card for VisionSuper28 CPU board as part of VisionSuper28 EVM developer kit. Figure 2. Vision Application Board www.ti.com Overview SPRUI53–February 2016 7 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated VisionSuper28 Vision Application Board Figure 3 shows the vision application board with OmniVision imager, LI single imager, and Aptina image head boards stackup at a different angle. Figure 3. Board With Imager Head Board Stackup Views 1.2 Features • Power supply – 12-V DC input – Power-on cycle sync-up with CPU board • PCB – Dimension (W × D): 170 mm × 140 mm – Supports a multi-des card for surrounding view • CPLD – Multiplexing – De-multiplexing – Buffer – Skew matching – Control and status indication • HDMI receiver – ADV7611 (Rev C and earlier use SiI9127) • CAN transceiver Hardware www.ti.com 8 SPRUI53–February 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated VisionSuper28 Vision Application Board • Image sensors interface – Aptina image sensor – LI image sensor head boards with Aptina and OmniVision sensors – OmniVision image sensor • FPD-Link III FMC DS90UB914Q daughter board – For stereoscopic view – For surrounding view • Linear guide rail – For adjusting the stereoscopic view • Connectors and headers – CAN interface header – HDMI receiver connecter – CPLD JTAG connectors – OmniVision imager head board connector – LI imager head board connector – Aptina adapter board connector – Multi-des board interface connector – 12-V power input connector 2 Hardware 2.1 Hardware Architecture The hardware architecture of the vision application EVM is shown in Table 1. Table 1. Hardware Architecture Product Description Vision Application Board Support multiplexing option for proprietary camera modules Support FPD-Link III FMC DS90UB914Q daughter board for stereoscopic view and/or surround view camera interface HDMI and CAN interface Multi-des card Four high-resolution camera for surround view Five or six lower-resolution camera for surround and stereoscopic view VisionSuper28 CPU Board SoC, memory devices, other interfaces, and so forth Stand-alone camera head boards AR0132 head board from Aptina OV10635 head board from OmniVision Single-imager head board from LI LI-M024-DUAL image head board from LI Serializer board Three or four surrounding-view image sensors with serializer boards Stereoscopic-view image sensors with serializer boards www.ti.com Image Sensors Head Boards SPRUI53–February 2016 9 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated VisionSuper28 Vision Application Board 2.1.1 Vision Application Board With Component Identification Figure 4 shows the major connectors and components on top side of the board. Figure 4. Board With Components Identifications Expansion connectors are on the bottom side of the board. These connectors interface with VisionSuper28 CPU board. 3 Image Sensors Head Boards 3.1 Proprietary Image Sensor Head Board Interface The vision application board supports proprietary image sensor modules interface of OmniVision, Aptina, and LI. Separate physical interface connectors are available for each module from different suppliers and signals are logically multiplexed and connected to the VIN1A IP of VisionSuper28. The image sensor modules are rigidly mounted onto the board or enclosure by using the head board of each image sensor module or with separate brackets based on the recommendation of the manufacturer. Image sensor modules are accessories to the vision application board and must be purchased by the user from manufacturers of the image sensor modules. Image Sensors Head Boards www.ti.com 10 SPRUI53–February 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated VisionSuper28 Vision Application Board 3.1.1 LI – Single Sensor Head Board Figure 5 shows that this image sensor board must be connected to the vision application board through flex cable assembly. Figure 5. LI Image Sensor Head Board Assembly The bracket for this image sensor head board is available from LI. Order this through the LI webpage. 3.1.2 LI – Dual Sensor Head Board LI high-resolution dual image sensor board LI-M024-DUAL incorporates two Aptina 1.2M CMOS digital image sensors MT9M024. Dual image sensor board LI-M024-DUAL has an option to use either single image sensor board or dual image sensor board. If used as a dual image sensor board, J3 and J4 connectors must be connected through FPC cable and the J1 connector must be connected to processor board through a flex cable. NOTE: The flex cable to connect J3 and J4 is supplied with the image sensor board. Their LI part number is LI-FLEX03. Purchase the cable to connect J1 to the processor board separately at http://shop.leopardimaging.com/product.sc?productId=55. Ensure the length of the cable is 6cm. Compared to the single image sensor head board, dual image sensor head board does not require a SPI interface and has an additional signal called Trigger on one of the NC pins of signal image sensor head board. The trigger pin can be controlled through the allocated GPIO pin shown in Section 3.8. NOTE: The LI dual image sensor board does not have a holding bracket, like the one available for single image sensor headboard. As Figure 6 shows, use a custom L-bracket for mounting on top of a silver box and vision application board. www.ti.com Image Sensors Head Boards SPRUI53–February 2016 11 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated VisionSuper28 Vision Application Board Figure 6. LI Dual Image Sensor Head Board Mounting 3.1.3 OmniVision Imager 3.1.3.1 Mounting Details The Omnivision image sensor does not require a special assembly to mount on top of a PCB. The sensor is directly connected with VisionSuper28 through a board-to-board connector. For more information, see Figure 7. Figure 7. OmniVision Imager Head Board Assembly Image Sensors Head Boards www.ti.com 12 SPRUI53–February 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated VisionSuper28 Vision Application Board As Figure 8 shows, the OmniVision imager head board does require a holder to position on top of silver box. Figure 8. OmniVision Image Head Board Assembly on Silver Box The holder part number is TFCCA-40-01 from Richo. 3.1.4 Aptina Imager – Head Board 3.1.4.1 Mechanical Arrangements An Aptina adapter card is used to provide mechanical support and easy way to electronically interface with the vision application board. For more information, see Figure 9. Figure 9. Aptina Head Board Assembly www.ti.com Image Sensors Head Boards SPRUI53–February 2016 13 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated VisionSuper28 Vision Application Board 3.2 FPD-Link III FMC DS90UB914Q Daughter Board Interface The six-channel FPD-Link III daughterboard offers up to six high-speed forward channels and a full duplex back channel for data transmission over a single differential pair. Each channel uses a TI DS90UB914Q de-serializer with its DS90UB913Q counterpart (on the remote serializer board) to form a serializer and de-serializer pair. Due to the nature of the DS90UB914Q and DS90UB913Q pair, only one I2C bus is required to access and configure all I2C devices attached to the FPD-Link daughter board. The vision application board supports the selection of up to six camera modules based on the use cases and requirements. Four camera modules are supported at the highest data bus width and five or six cameras are supported using narrower data bus widths for each camera module. Number of Cameras and Interface Configuration Option: • When five or six channels are used, the maximum supported number of data signals per channel is eight or nine and horizontal sync (hsync), vertical sync (vsync), and clock. • When six channels are used without vsync, ten data lines plus hsync and clock can be handled. • When four channels are used, twelve data signals per channel and, hsync, vsync, and clock can be handled. This configuration selection process is performed on the FPD-Link III FMC DS90UB914Q multideserializer daughter board. Based on the implemented configuration on this board, the demultiplexing must be performed on the CPLD available from the vision application board to extract the appropriate required signal per the configuration in the FPD-Link III board. 3.2.1 CAM Signal Demultiplexing Depending on the configurations of the number of channels, usage, and number of data lines, a few signals are multiplexed and transmitted from the serializer end. Those signal must be de-multiplexed in the de-serializer end. Table 2 shows which signals are multiplexed according to the configuration option in the FPD-Link III board. Table 2. List of De-Multiplexed Signals FPD_A FPD_B FPD_C CAM6_D1_CAM3_VS CAM1_D0_CAM1_VS CAM5_D1_CAM1_VS CAM6_D2_CAM3_D10 CAM2_D0_CAM2_VS CAM5_D2_CAM1_D10 CAM6_D3_CAM3_D11 CAM3_D0_CAM3_VS CAM5_D3_CAM1_D11 CAM6_D4_CAM4_VS CAM4_D0_CAM4_VS CAM5_D4_CAM2_VS CAM6_D5_CAM4_D10 CAM5_D0_CAM5_VS CAM5_D5_CAM2_D10 CAM6_D6_CAM4_D11 CAM6_D0_CAM6_VS CAM5_D6_CAM2_D11 Table 3 and Table 4 show the method in which signals are de-multiplexed according to the configuration in the FPC-Link III board. Table 3. CAM Input De-Multiplexer Image Sensor Interface Option DeMUX_FPD_A DeMUX_FPD_B DeMUX_FPD_C 6 Channels (8Bit, HS, VS, PCLK) S0=1 S0=0 S0=1 6 Channels (10Bit, HS, PCLK) S0=1 S0=1 S0=1 4 Channels (12Bit, HS, VS, PCLK) S0=0 S0=1 S0=0 Image Sensors Head Boards www.ti.com 14 SPRUI53–February 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated VisionSuper28 Vision Application Board Table 4. De-Multiplexing as Per Required Configuration Signal Name Control Signal S0 = 1 S0 = 0 DeMUX_FPD_A CAM6_D1_CAM3_VS CAM6_D1 CAM3_VS CAM6_D2_CAM3_D10 CAM6_D2 CAM3_D10 CAM6_D3_CAM3_D11 CAM6_D3 CAM3_D11 CAM6_D4_CAM4_VS CAM6_D4 CAM4_VS CAM6_D5_CAM4_D10 CAM6_D5 CAM4_D10 CAM6_D6_CAM4_D11 CAM6_D6 CAM4_D11 DeMUX_FPD_B CAM1_D0_CAM1_VS CAM1_D0 CAM1_VS CAM2_D0_CAM2_VS CAM2_D0 CAM2_VS CAM3_D0_CAM3_VS CAM3_D0 CAM3_VS CAM4_D0_CAM4_VS CAM4_D0 CAM4_VS CAM5_D0_CAM5_VS CAM5_D0 CAM5_VS CAM6_D0_CAM6_VS CAM6_D0 CAM6_VS DeMUX_FPD_C CAM5_D1_CAM1_VS CAM5_D1 CAM1_VS CAM5_D2_CAM1_D10 CAM5_D2 CAM1_D10 CAM5_D3_CAM1_D11 CAM5_D3 CAM1_D11 CAM5_D4_CAM2_VS CAM5_D4 CAM2_VS CAM5_D5_CAM2_D10 CAM5_D5 CAM2_D10 CAM5_D6_CAM2_D11 CAM5_D6 CAM2_D11 3.2.2 Board Presence Detection In Row D, pins 30 and 31 are used for board presence detection, as shown in Figure 10. Figure 10. Board Presence Detection 3.2.3 I2C Slave Address Configuration To avoid I2C slave address conflict with the board info EEPROM, the FPD-Link III FMC DS90UB914Q daughter board has an option to configure a I2C slave address by using the FMC_GA1(D35) and FMC_GA0(C34) pins. For I2C slave address configurations, both pull-up and pull-down options are provided for the FMC_GA1(D35) and FMC_GA0(C34) pins.10K Ω 1% Tol. resistors are already available on these lines in the FPD-Link III board. By default, both the FMC_GA1 (D35) and FMC_GA0 (C34) nets are pulled down to ground. www.ti.com Image Sensors Head Boards SPRUI53–February 2016 15 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated VisionSuper28 Vision Application Board 3.3 HDMI Receiver Interface The HDMI receiver on the vision apps board can be used to receive stored images from an external storage medium, and have the images played back on an external display through the HDMI transmitter available on the CPU board or through a wireless display. Figure 11. HDMI Wiring Connection Image Sensors Head Boards www.ti.com 16 SPRUI53–February 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated VisionSuper28 Vision Application Board 3.3.1 HDMI Signal-Level Connections Figure 12 shows the detailed signal-level connections between the HDMI connector, receiver, multiplexer, and VisionSuper28 CPU expansion board connector. Figure 12. HDMI Signal-Level Connections 3.4 Auto Vision Video Muxing The main functionality of the Vision app board is to multiplex the video signals from: • One of three proprietary image sensor types • HDMI input from an external video source • CAM1 and CAM3 signals from the FPD-Link III FMC DS90UB914Q daughter board www.ti.com Image Sensors Head Boards SPRUI53–February 2016 17 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated VisionSuper28 Vision Application Board The Vision app board can be used as video muxing interface to run: • Captured running images from proprietary image sensors (or) • HDMI from an external video source interface (or) • Surround view or stereoscopic view from the FPD-Link III FMC DS90UB914Q daughter board The Mux input selection chart is shown in Table 5. Table 5. Mux Output Selection Chart MUX2_SEL[1] MUX2_SEL[0] MUX_OUT 0 0 HDMI RECEIVER 0 1 EXTERNAL IMAGER MUX1_SEL[1] MUX1_SEL[0] MUX_OUT 0 0 LI_IMAGER 0 1 OV_IMAGER 1 0 APTINA_IMAGER 1 1 HIGH Z 1 0 CAM1 and CAM3 of FPD_LINK 1 1 HIGH Z Both a software and manual mode select are available. A dip switch is provided for the manual selection. For mapping, see Table 6. Table 6. List of Dip Switch Signals Position Description 2-1 MUX1_SEL Manual Setting 4-3 MUX2_SEL Manual Setting 5 DeMux_FPD_A Manual Setting 6 DeMux_FPD_B Manual Setting 7 DeMux_FPD_C Manual Setting 8 Mode Selection: 0 – Use DIP SWITCH for configuration (manual control) 1 – Use control signals for configuration (software control) For the camera inputs (OmniVision, Aptina, Leopard Imaging), there are two different data modes available: straight data and shifted data, as shown in Table 7. Table 7. Camera Data Modes Camera Input Control Signal (DeMux_FPD_B) =0 (Shift) =1 (Straight) OmniVision Data = “00” and (9 to 2) Data = (9 downto 0) Aptina Data = “0000” and (11 to 4) Data = (11 downto 0) Leopard Imaging Data = “0000” and (13 to 4) Data = (13 downto 0) 3.5 CPLD Logic All the required logic for CAM signal de-multiplexing (see Section 3.2.1), and CAM signal buffering and auto vision multiplexing (see Section 3.4) are implemented with CPLDs to ensure the propagation delay is within the limit. CPLD 5M2210ZF324C4M from Altera has been used for this logic implementation. Figure 13 shows the top-level blocks of logic implemented in the CPLDs. There are two numbers of CPLDs used for this logic implementation. Image Sensors Head Boards www.ti.com 18 SPRUI53–February 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated VisionSuper28 Vision Application Board Figure 13. CPLD Logic Implementation www.ti.com Image Sensors Head Boards SPRUI53–February 2016 19 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated VisionSuper28 Vision Application Board Table 8 shows the VIN signal mapping. Table 8. VIN and Camera Signal Mapping Signal Name Signal at Exp. Conn Signal Used As CAM1_D[11:0] VIN1A_D[11:0] VIN1A_D[11:0] CAM1_HSYNC VIN1A_HSYNC VIN1A_HSYNC CAM1_VSYNC VIN1A_VSYNC VIN1A_VSYNC CAM1_PCLK VIN1A_CLK0 VIN1A_CLK0 CAM2_D[11:0] VIN2A[11:0] VIN2A[11:0] CAM2_HSYNC VIN2A_HSYNC VIN2A_HSYNC CAM2_VSYNC VIN2A_VSYNC VIN2A_VSYNC CAM2_PCLK VIN2A_CLK0 VIN2A_CLK0 CAM3_D[0:7] VIN1A_D[16:23] VIN3A_[0:7] CAM3_D[8:11] VIN2A_D[16:19] VIN3A_[8:11] CAM3_HSYNC VIN2A_D[22] VIN3A_HSYNC CAM3_VSYNC VIN2A_D[23] VIN3A_VSYNC CAM3_PCLK VIN1B_CLK1 VIN3A_CLK0 CAM4_D[0] VIN5A_D[0] MMC3_DAT[5] CAM4_D[1] VIN5A_D[1] MMC3_DAT[4] CAM4_D[2] VIN5A_D[2] MMC3_DAT[3] CAM4_D[3] VIN5A_D[3] MMC3_DAT[2] CAM4_D[4] VIN5A_D[4] MMC3_DAT[1] CAM4_D[5] VIN5A_D[5] MMC3_DAT[0] CAM4_D[6] VIN5A_D[6] MMC3_CMD CAM4_D[7] VIN5A_D[7] MMC3_CLK CAM4_D[8:11] VIN5A_D[8:11] VIN5A_D[8:11] CAM4_HSYNC MMC3_DAT[6] VIN5A_HSYNC0 CAM4_VSYNC MMC3_DAT[7] VIN5A_VSYNC0 CAM4_PCLK VIN5A_CLK0 VIN5A_CLK0 CAM5_D[2:9] VIN4B_D[0:7] VIN4B_D[0:7] CAM5_HSYNC VIN4B_HSYNC1 VIN4B_HSYNC1 CAM5_VSYNC VIN4B_VSYNC1 VIN4B_VSYNC1 CAM5_PCLK VIN4B_CLK1 VIN4B_CLK1 CAM6_D[0:3] VIN6A_D[0:3] VIN6A_D[0:3] CAM6_D[4] McASP2_AXR3 VIN6A_d[4] CAM6_D[5] McASP2_AXR2 VIN6A_d[5] CAM6_D[6] McASP2_AFSX VIN6A_d[6] CAM6_D[7:9] VIN6A_D[7:9] VIN6A_D[7:9] CAM6_HSYNC VIN6A_HSYNC VIN6A_HSYNC CAM6_VSYNC VIN6A_VSYNC VIN6A_VSYNC CAM6_PCLK MCA6_AHCLKX VIN6A_CLK0 3.6 CAN Interface CAN PHY SN65HVDA541 is used in the DCAN2 interface of the VisionSuper28 CPU to provide support for the CAN interface in the Vision apps board. Image Sensors Head Boards www.ti.com 20 SPRUI53–February 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated VisionSuper28 Vision Application Board 3.7 I2C Interface Table 9 shows the list of I2C slave devices in the Vision app board and Figure 14 shows the interface to the master device (VisionSuper28 CPU) on I2C2. (1) LSB Bit '0' : 0 - Write access 1 - Read access Table 9. I2C Devices Slave Address S. No Device(1) Slave Address (7-bit of MSB) 1 LI Single Imager - LI-OV01633 0x0110 000 2 LI Dual Imager -LI-M024-DUAL a Image Sensor MT9M024-1 0x0010 000 b Image Sensor MT9M024-2 0x0011 000 3 OV Imager - OV10635 0x0110 000 4 Aptina Imager - AR0132 0x0010 000 5 FBD-Link III FMC DS90UB914Q Daughter card a GPIO Expander 1 (for configuration and control register ) 0x0100 111 b GPIO Expander 2 (for configuration and control register ) 0x0100 110 c GPIO Expander 3 (for configuration and control register ) 0x0100 101 d INFO EEPROM 0x1010 000 e De-Serializer 1 0x1100 000 f De-Serializer 2 0x1100 100 g De-Serializer 3 0x1101 000 h De-Serializer 4 0x1101 100 i De-Serializer 5 0x1100 001 j De-Serializer 6 0x1101 001 6 HDMI Receiver – ADV7611 a HDMI IO map 0x1001 100 b CP map (disabled by default) 0x00 (Program) c HDMI map (disabled by default) 0x00 (Program) d Repeater map (disabled by default) 0x00 (Program) e EDID map (disabled by default) 0x00 (Program) f InfoFrame map (disabled by default) 0x00 (Program) g CEC map (disabled by default) 0x00 (Program) 7 Optional EEPROM 0x1010 000 www.ti.com Image Sensors Head Boards SPRUI53–February 2016 21 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated VisionSuper28 Vision Application Board Figure 14. I2C Interface in Vision Apps Board Image Sensors Head Boards www.ti.com 22 SPRUI53–February 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated VisionSuper28 Vision Application Board There is an optional EEPROM connected between the E-DDC and I2C2 bus, through the signal switch for HDMI handshaking when connected to the HDMI media devices. This signal switch is used to connect the I2C2 bus for writing, and the E-DDC bus for reading, by changing the signal switch inter-connections using the selected pin. Figure 15. HDMI E-DDC I2C Interface Table 10. HDMI E-DDC I2C Device Addresses HDMI Receiver ADV7611 Device Slave Address (7-bit of MSB) E-DDC Bus Interface EDID (Programmable) Optional EEPROM 0x1010 000 www.ti.com Image Sensors Head Boards SPRUI53–February 2016 23 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated VisionSuper28 Vision Application Board 3.8 GPIO Control and Monitor Table 11 shows the list of GPIOs required for monitor, control, and reset in Vision apps board devices and components. Table 11. GPIO Mapping of Device Control Function Peripheral Device Vision Apps Bd Net Vision Apps Bd Net (I/F Conn Ref Des.Pin) GPIO/Sym Ball Name (Ball No.) Camera Aptina Imager APT_TRIGGER_VIN[5]A _D[12] VIN[5]A_D[12] (EXP_P1 .9) MCASP4_AXR1 (D17) Camera OmniVision OV_PWDN GP6[17] (EXP_P1 .15) XREF_CLK0 (D18) GPIO6_17 Interface CAN PHY CAN_MODE_SEL_GPI O VIN[5]A_D[13] (EXP_P1 .18) MCASP4_AXR0 (G16) Imager Imager/HDMI Receiver GPIO_USER_RESET VIN[5]A_D[15] (EXP_P1 .12) MCASP4_ACLKX (C18) HDMI Recorder HDMI Receiver HDMI_EVNODD MCA2_AXR1 (EXP_P2.33) MCASP2_AXR1 (A15) HDMI Recorder HDMI Receiver HDMI_INT GP5[1] (EXP_P2.36) MCASP1_FSR (J14) GPIO5_1 HDMI Recorder HDMI Receiver HDMI_SCDT GP5[0] (EXP_P2.34) MCASP1_ACLKR (B14) GPIO5_0 HDMI Recorder HDMI Receiver HDMI_CEC_D GP5[17] (EXP_P2.32) RMII_MHZ_50_CLK (U3) GPIO5_17 Remote camera I/F FPD_LINK III Brd FPD_LINK_DB_DET MCA2_AXR0 (EXP_P2.37) MCASP2_AXR0 (B15) Camera LI Dual Image Sensor LI_DUAL_Trigger VIN[5]A_D[14] (EXP_P1 .11) MCASP4_FSX (A21) CPLD control and status signals CPLD Logic DEMUX_FPD_B MCA2_AXR4 (EXP_P2.23) MCASP2_AXR4 (D15) GPIO1_4 CPLD Logic DEMUX_FPD_A MCA2_AXR6 (EXP_P2.22) MCASP2_AXR6 (B17) GPIO2_29 CPLD Logic DEMUX_FPD_C MCA2_AXR5 (EXP_P2.24) MCASP2_AXR5 (B16) GPIO6_7 CPLD Logic MUX1_SEL0 VIN2A_D[12] (EXP_P2.93) VIN2A_D12 (D5) GPIO4_13 CPLD Logic MUX2_SEL0 VIN[2]A_D[14] (EXP_P2.95) VIN2A_D14 (C3) GPIO4_15 CPLD Logic MUX1_SEL1 VIN2A_D[13] (EXP_P2.94) VIN2A_D13 (C2) GPIO4_14 CPLD Logic MUX1_SEL1 VIN2A_D[15] (EXP_P2.96) VIN2A_D15 (C4) GPIO4_16 Camera Module Aptina Camera Module OmniVision Camera Module LI CAN Transceiver SN65HVDA541 CPLD 2 DS90UB914Q Adapter Card 175mA HDMI Transceiver 210mA 220mA 21mA 0.3mA 70mA 90mA 90mA 326mA 366mA 8mA 2300mA 400mA CPLD 1 152mA 152mA TPS74701 1.8V TPS74701 1.2V Input Power 44735mW @ 85% Efficiency (12V @ 3727mA) TPS74701 3.3V TPS54362PWPRQ1 3.3V @ 1431mA TPS54362PWPRQ1 5V @ 850mA EN(3.3V from CPU board) Image Sensors Head Boards www.ti.com 24 SPRUI53–February 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated VisionSuper28 Vision Application Board 3.9 Power Supply Tree The Vision apps board power supply tree is shown in Figure 16. Figure 16. Power Supply Tree Chart www.ti.com References SPRUI53–February 2016 25 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated VisionSuper28 Vision Application Board 4 References • TDA2x EVM CPU Board User's Guide (SPRUI51) • TDA2x Vision EVM Application Board PCB Rev D (SPRR224) • TDA2x Vision EVM Application Board Schematic Rev D (SPRR225) • TDA2x Vision EVM Application Board CPLD Rev D (SPRR226) • TDA2x Vision EVM Application Board BOM Rev D (SPRR227) • TDA2x Vision EVM Application Board CPU Assembly Drawing Rev D (SPRR228) • TDA2x Vision EVM Application Board CPU PCB Drawing Rev D (SPRR229) STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES 1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions. 1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software 1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system. 2 Limited Warranty and Related Remedies/Disclaimers: 2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License Agreement. 2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as mandated by government requirements. TI does not test all parameters of each EVM. 2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period. 3 Regulatory Notices: 3.1 United States 3.1.1 Notice applicable to EVMs not FCC-Approved: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter. 3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant: CAUTION This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. 3.2 Canada 3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 Concerning EVMs Including Radio Transmitters: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concernant les EVMs avec appareils radio: Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concerning EVMs Including Detachable Antennas: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur 3.3 Japan 3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に 輸入される評価用キット、ボードについては、次のところをご覧ください。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan. If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of Japan to follow the instructions below with respect to EVMs: 1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, 2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or 3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan. SPACER SPACER SPACER SPACER SPACER 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 2. 実験局の免許を取得後ご使用いただく。 3. 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿６丁目２４番１号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page SPACER 4 EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS. 4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages. 4.3 Safety-Related Warnings and Restrictions: 4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm. 4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees. 4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements. 5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free. SPACER SPACER SPACER SPACER SPACER SPACER SPACER 6. Disclaimers: 6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS. 6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF THE EVM. 7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED. 8. Limitations on Damages and Liability: 8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED. 8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT. 9. Return Policy. 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